A Mini Review on Elucidating Wire Lifting Defects due to Au5Al2 Formation in LED Thermosonic Bonding

Abstract

The light-emitting diodes (LEDs) are commonly employed as a light source because of its energy efficiency and great light intensity. The reliability of LED components is critical, especially when they are employed as safety equipment in medical devices, automobiles, ad aerospace, among other applications. LED failure due to wire connections must be avoided at all costs. Wire bonding is one of the methods used in LED manufacture. Ball lifting and wedge lifting is one of the failures in wire bonding process. Ball lifting is the process of separating a ball bond from a semiconductor device's bond pad. There are numerous explanations why this might be the situation. Ball lifting and wedge lifting is caused by an improper wire bonding configuration and contamination of the bond pad surface. Unstable work piece holders, incorrect wire bond parameter configurations, and outdated wire bonding equipment are all factors in an inadequate setup. The bond pad and the ball as a result have inadequate initial welding and insufficient intermetallic formation. The connection will break because of this problem, and the LED will stop working.