Thermal Analysis of LED Packaging with Single-Walled Carbon Nanotube Heat Sink

Abstract

The thermal issue is still the bottleneck of a light emitting diode (LED) system to sustain its operational performance. In this paper, we design, simulated, and analysed an LED packaging with single walled carbon nanotubes as a heat sink. The 5W LED packaging is simulated with different types of LED chips materials which comprise gallium nitride, indium nitride, zinc oxide, zinc selenide and titanium dioxide. Using LED chips materials as the heat source, the heat flow is conducted through the bottom layer to the heat sink and dissipates by convection or radiation heat transfer to the surrounding. The addition of thin film on top of the phosphorus layer functions to enhance the recombination rate and guided the flow of heat to the bottom. The 5W titanium dioxide light emitted diode packaging (LED packaging C) has been successfully demonstrated to have overall temperature reduced to around ~10°C by using single walled carbon nanotube heat sink as compared to copper heat sink and aluminium heat sink. Meanwhile, carbon material as thermal interface material and substrate also plays a major role as a thermal cooling solution in LED packaging. For 5W titanium dioxide light emitted diode packaging, under self-heating conditions, the maximum average temperature generated is 81.05 °C. Despite that, under convection conditions, the maximum average temperature generated is 41.53°C.