The Impact of Stress Distribution on The Electrical Performance of Different Silver Stretchable Conductive Ink Pattern Using FEA Simulation

Authors

  • Daniel Azlan Mohd Azli
  • Mizah Ramli
  • Mohamad Shukri Zakaria
  • Mohd Nur Azmi Nordin
  • Ghazali Omar
  • Mariam Md Ghazaly
  • Abdul Halim Lim Abdullah

DOI:

https://doi.org/10.58915/ijneam.v16i1.1217

Abstract

Stretchable conductive ink has been widely investigated to be used in the fabrication of stretchable electrical devices. Experimentation methods to test the mechanical and electrical behaviours of the stretchable conductive ink composite are commonly applied; however, not much of the computational approach has been scrutinized to validate the results further. This paper employs the finite element analysis method to investigate the relationship between the stress and strain distribution of the stretchable conductive ink with the highest strain obtained. This research validates the past experimentation works of different patterns of stretchable conductive ink for its stretchability and electrical performance. The maximum Von Mises stress (VMS) and maximum principal strain of the stretchable conductive ink played a significant role in determining its electrical performance, rather than the localisation of high stress and strain at specific locations within the stretchable conductive ink pattern. Zigzag pattern exhibited the lowest maximum stress and strain concentration at 57.826 MPa and 4.05% while straight pattern suffered the highest respective values at 118.143 MPa and 10.39%. The lower maximum Von-Mises stress and principal strain contributed to a better stretchability which is indicated by a higher strain rate prior to electrical conductivity.

Keywords:

Stress distribution analysis, Strain distribution analysis, FEA, SCI, Stretchability

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Published

22-10-2024

How to Cite

[1]
Daniel Azlan Mohd Azli, “The Impact of Stress Distribution on The Electrical Performance of Different Silver Stretchable Conductive Ink Pattern Using FEA Simulation”, IJNeaM, vol. 16, no. 1, pp. 195–216, Oct. 2024.

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Articles