Corrosion Behaviour and Morphological Analysis of Ni/CuNanolayer Coating in Salt Solution

Abstract

The electrochemical corrosion studies of Nickel/Copper (Ni/Cu) compositionally modulated multilayer nanolayer (CMM) in 3.5 wt% of Sodium Chloride (NaCl) solution at room temperature were investigated using potentiodynamic polarization (PDP) method. A multi-nanolayer of Ni/Cu with the total thicknesses of 3μm was successfully produced on Cu substrate via electrodeposition process through dual bath technique (DBT). The electrodeposition with 3different sublayer thicknesses (40 nm, 80 nm and 10 0 nm) was produced by varying the deposition time. The results of electrochemical experiment indicate that Ni/Cu multinanolayer coating have superior corrosion resistance in 3.5 wt % of NaCl solution than the uncoated Cu substrate. The corrosion resistance is increased when the sublayer thicknesses decrease. The morphological analysis of Ni/Cumulti-nanolayer after corrosion te sting was examined. The results shows that the uncoated Cu substrate corrode faster if compared to that of Cu substrate coated with Ni/Cu multi-nanolayer coating.