Muhammad Amirul Aiman A. Ramlee, Rita Mohd Said, Nur Syahirah Mohamad Zaimi, Norainiza Saud. The Microstructure Evolution and Activation Energy Study of Cu6Sn5 and Cu3Sn Intermetallic Compound Layer of Sn-10Cu/Cu Solder Joint. IJNeaM [Internet]. 2024 Aug. 13 [cited 2024 Sep. 19];17(3):422-7. Available from: https://ejournal.unimap.edu.my/index.php/ijneam/article/view/1158