Jing Heng Koay, et al. “Hexagonal Boron Nitride (hBN) and Cordierite in Epoxy Underfill Materials: Single Filler System”. International Journal of Nanoelectronics and Materials (IJNeaM) , vol. 18, no. December, Dec. 2025, pp. 67-74, doi:10.58915/ijneam.v18iDecember.2810.