Muhammad Luqman Mokhtar, et al. “Effect of Multiple Reflow Cycles and Isothermal Aging on Shear Strength in SAC305 Sn58Bi Cu-OSP Hybrid Solder Joint”. International Journal of Nanoelectronics and Materials (IJNeaM) , vol. 17, no. December, Dec. 2024, pp. 341-6, doi:10.58915/ijneam.v17iDecember.1640.