Muhammad Amirul Aiman A. Ramlee, et al. “The Microstructure Evolution and Activation Energy Study of Cu6Sn5 and Cu3Sn Intermetallic Compound Layer of Sn-10Cu Cu Solder Joint”. International Journal of Nanoelectronics and Materials (IJNeaM) , vol. 17, no. 3, Aug. 2024, pp. 422-7, doi:10.58915/ijneam.v17i3.1158.