MOHD UZAIR ROSLI; KHOR CHU YEE; MOHD FATHULLAH GHAZLI; MUHAMMAD SYAMIL ZAKARIA; MASNIEZAM AHMAD. Investigation of Significant Parameter and Interaction of Plastic Transfer Molding Parameters for 3D Dual In-Line IC Package Encapsulation. International Journal of Nanoelectronics and Materials (IJNeaM) , [S. l.], v. 19, n. June, p. 261–270, 2026. DOI: 10.58915/ijneam.v19iJune.3397. Disponível em: https://ejournal.unimap.edu.my/index.php/ijneam/article/view/3397. Acesso em: 16 jul. 2026.