MUHAMMAD LUQMAN MOKHTAR; FLORA SOMIDIN; MOHD ARIF ANUAR MOHD SALLEH. Effect of Multiple Reflow Cycles and Isothermal Aging on Shear Strength in SAC305/Sn58Bi/Cu-OSP Hybrid Solder Joint. International Journal of Nanoelectronics and Materials (IJNeaM) , [S. l.], v. 17, n. December, p. 341–346, 2024. DOI: 10.58915/ijneam.v17iDecember.1640. Disponível em: https://ejournal.unimap.edu.my/index.php/ijneam/article/view/1640. Acesso em: 11 jan. 2025.