MUHAMMAD AMIRUL AIMAN A. RAMLEE; RITA MOHD SAID; NUR SYAHIRAH MOHAMAD ZAIMI; NORAINIZA SAUD. The Microstructure Evolution and Activation Energy Study of Cu6Sn5 and Cu3Sn Intermetallic Compound Layer of Sn-10Cu/Cu Solder Joint. International Journal of Nanoelectronics and Materials (IJNeaM) , [S. l.], v. 17, n. 3, p. 422–427, 2024. DOI: 10.58915/ijneam.v17i3.1158. Disponível em: https://ejournal.unimap.edu.my/index.php/ijneam/article/view/1158. Acesso em: 19 dec. 2024.