Muhammad Luqman Mokhtar, Flora Somidin, & Mohd Arif Anuar Mohd Salleh. (2024). Effect of Multiple Reflow Cycles and Isothermal Aging on Shear Strength in SAC305/Sn58Bi/Cu-OSP Hybrid Solder Joint. International Journal of Nanoelectronics and Materials (IJNeaM), 17(December), 341–346. https://doi.org/10.58915/ijneam.v17iDecember.1640