Muhammad Amirul Aiman A. Ramlee; Rita Mohd Said; Nur Syahirah Mohamad Zaimi; Norainiza Saud. The Microstructure Evolution and Activation Energy Study of Cu6Sn5 and Cu3Sn Intermetallic Compound Layer of Sn-10Cu/Cu Solder Joint. IJNeaM 2024, 17, 422-427.