Muhammad Amirul Aiman A. Ramlee et al. 2024. The Microstructure Evolution and Activation Energy Study of Cu6Sn5 and Cu3Sn Intermetallic Compound Layer of Sn-10Cu/Cu Solder Joint. International Journal of Nanoelectronics and Materials (IJNeaM) . 17, 3 (Aug. 2024), 422–427. DOI:https://doi.org/10.58915/ijneam.v17i3.1158.