Muhammad Amirul Aiman A. Ramlee, Rita Mohd Said, Nur Syahirah Mohamad Zaimi and Norainiza Saud 2024. The Microstructure Evolution and Activation Energy Study of Cu6Sn5 and Cu3Sn Intermetallic Compound Layer of Sn-10Cu/Cu Solder Joint. International Journal of Nanoelectronics and Materials (IJNeaM) . 17, 3 (Aug. 2024), 422–427. DOI:https://doi.org/10.58915/ijneam.v17i3.1158.