SAKAKI, Mohd Redzwan; JUSOH, M S; ISMAIL, A H; MOHD SALLEH, M A A; MOHD AMLI, S F N. A Systematic Literature Review on the Application of Artificial Neural Networks for Predicting Sn-Cu Lead-Free Solder Joint Strength. International Journal of Autonomous Robotics and Intelligent Systems (IJARIS), [S. l.], v. 1, n. 2, p. 239–248, 2025. Disponível em: https://ejournal.unimap.edu.my/index.php/ijaris/article/view/2679. Acesso em: 2 jan. 2026.