ROSLI, Mohd Uzair; NAJIH, M.; GHAZLI, Mohd Fathullah. Simulation-Based Optimization of Plastic Transfer Molding Parameter for IC Package Encapsulation Process. Advanced and Sustainable Technologies (ASET), [S. l.], v. 5, n. 1, p. 100–113, 2026. DOI: 10.58915/aset.v5i1.3199. Disponível em: https://ejournal.unimap.edu.my/index.php/aset/article/view/3199. Acesso em: 7 jun. 2026.